16L Blind Vias Backplane PCB

With the continuous improvement of IC (integrated circuit) component integration, the increasing number of I/Os, and the rapid advancement of electronic assembly technology, high-frequency signal transmission, and high-speed digitization, the functions of backplanes have gradually expanded beyond simple bearing to include signal transmission and distribution for functional boards. To fulfill these expanded functions, backplanes must meet more stringent technical requirements in terms of layer count (20 to 60 layers), board thickness (4 mm to 12 mm), number of through-holes (30,000 to 100,000), reliability, operating frequency, and signal transmission quality.