12 Layers 3 order HDI Communication PCB

Name: 12 Layers 3 order HDI Communication PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Product Model: 12-Layer 3rd-Order HDI PCB for Communication Equipment

Layer Configuration: 12-layer multilayer HDI structure

Base Material: TUC TU872slk high-performance laminate

Stackup Design: 3+6+3 laminated HDI architecture

Finished Board Thickness: 1.2 mm

Copper Foil Weight: 0.5 oz, uniform thickness for all layers

Solder Mask Color: Blue / white optional

Surface Finishing: Electroless Nickel Immersion Gold (ENIG)

Special Process: No customized special processes

Minimum Line Width / Spacing: 2.5 mil / 2.5 mil

Application Field: Professional communication equipment and related electronic devices

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Description
Data Sheet

As the core foundational carrier of electronic systems, printed circuit boards are widely applied across the electronics industry and regarded as a key fundamental material for electronic equipment. Its downstream coverage includes communications, computers, consumer electronics, industrial control, medical devices, automotive electronics, aerospace and other fields. Among them, communication and computer sectors occupy the dominant share of PCB market demand, accounting for over 25% of the overall application scale.

In the communication industry, PCBs are core components for wireless networks, transmission networks, data interaction and fixed broadband systems. Typical applied products cover industrial backplane boards, high-speed high-density multilayer PCBs, high-frequency circuit boards, microwave specialized boards and high-reliability metal substrate PCBs.

Driven by 5G infrastructure construction, the demand for high-performance PCBs in wireless base stations, bearer transmission networks and core network facilities continues to expand. Meanwhile, the iterative upgrading of 5G terminal devices such as smartphones and smart wearable products further boosts the market demand for high-precision communication-grade PCBs.

To meet the mass production and customized demands of the communication sector, Maxipcb is equipped with a full-process in-house production line for communication circuit boards, effectively reducing external outsourcing links and stabilizing delivery and quality risks.

Targeted for communication product manufacturing, the factory is equipped with dedicated core processing equipment, including plasma desmear machines and extra-long parallel exposure units, with a maximum exposure processing length up to 2 meters. Meanwhile, multiple specialized surface treatment production lines are deployed, featuring plating silver, immersion tin, immersion silver and chemical tin processes to meet the diversified surface finishing requirements of communication equipment.

With sophisticated manufacturing craftsmanship and accumulated industrial experience, Maxipcb fully adapts to the high-standard production requirements of communication PCBs. It has mastered mature mixed lamination technologies, including FR4 combined with PTFE, FR4 matched with 408HR high-speed materials, FR4 & Rogers high-frequency composite boards, and ceramic-based hybrid stacking structures.

In terms of precision manufacturing indicators, the company can stably mass produce fine circuits with 1.5mil line width and line spacing. For high-speed signal products with impedance design requirements, the impedance tolerance can be controlled within ±5%, fully satisfying the electrical performance indicators of high-frequency and high-speed communication PCBs.

Model : 12 layers 3 order HDI Communication PCB

Layers : 12Layers

Material : TU872slk

Construction : 3+6+3 HDI PCB

Finished Thickness：1.2mm

Copper Thickness : 0.5OZ

Color : Blue/White

Surface treatment: immersion gold

Special technology: None

Min Trace / Space：2.5mil/2.5mil

Application : communication product pcb board

12 Layers 3 order HDI Communication PCB

Description

Data Sheet