Name: 1+N+1 Countersink hole HDI 8L PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

Maxipcb is a specialized manufacturer with 17 years of focused experience in RF and microwave high‑frequency PCB fabrication.

We recognize that dielectric material selection directly determines high‑frequency signal performance and circuit stability. Critical factors including operating frequency, microwave power density, temperature resistance, current load and voltage rating are fully evaluated to select the optimal raw material for each high‑frequency project.

Our team maintains in‑depth expertise across mainstream high‑frequency dielectrics. A complete range of RF substrates are kept in sufficient inventory to shorten lead time and support rapid production delivery.

Strict quality performance is driven by our experienced engineering and production teams, working closely with the internal QA system to ensure all circuits meet international industrial standards. Rather than passive evaluation, sustained repeat orders from global partners fully reflect customer recognition and long‑term trust.

Quality serves as our foundational business principle, ensuring stable cooperation for global long‑term projects. Over 17 years, we have continuously upgraded manufacturing processes, technical capabilities and mass production capacity, growing steadily alongside worldwide clients.

RF & Microwave PCB Materials

Premium high-frequency laminates for wireless and RF designs:

Rogers: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870
Arlon, Isola, Taconic
PTFE, F4BM and Teflon series high-performance dielectrics

Hybrid Mixed Dielectric Laminates

Cost-effective hybrid structures combining high-frequency materials with standard FR‑4 substrates:

RO4350B + FR4 / IT180
RO4003C + FR4
RO3010 / RO3003 + FR4

Standard Surface Finishes

OSP, ENIG, Lead-Free HASL, hard gold plating, soft flash gold, immersion tin, immersion silver, electrolytic gold

Core Process Capabilities

Golden finger circuitry, heavy copper construction, blind & buried vias, precision impedance control, resin hole filling, carbon ink printing, backdrilling, countersink, depth-limited drilling, half-plated holes, press-fit holes, peelable solder mask, ultra-thick copper and oversized board processing

Technical Specifications

Layer count: 2 – 30 layers
Dielectric Constant (DK): 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2

Application Scope

Our high-frequency and RF PCBs are widely applied across multiple high-end sectors:

Military & aerospace, communication antenna systems, high-power equipment, medical devices, automotive electronics, industrial automation, consumer electronics, cellular handheld terminals, Wi‑Fi antennas, vehicle telematics, radar systems and power amplifiers.

WiFi Module Custom PCB Solutions

Maxipcb delivers high-reliability, customized PCB solutions for full-range WiFi modules, covering consumer-grade general WiFi units, router mainboard modules and embedded low-power WiFi hardware.

Equipped with advanced HDI fabrication, automated production lines and standardized quality control, our circuit boards feature compact sizing, stable high‑frequency signal transmission and outstanding structural reliability.

WiFi Module Classification & Technical Adaptation

General WiFi Modules
Applied in smartphones, laptops and tablets, these modules rely on host operating systems including iOS, Windows and Android to operate network protocols, requiring high-performance CPU matching.
Router-Grade WiFi Modules
Adopted for wireless routing devices, designed with high-capacity Flash and RAM chips based on Linux architecture, to realize full-coverage wireless networking and multi-device concurrent connection.
Embedded WiFi Modules
Integrated with 32-bit MCU and built-in WiFi protocol stacks, supporting mainstream MCU interfaces such as UART. Compact and low-power, ideal for smart home hardware and IoT terminal products.

High‑Frequency PCB Manufacturing Technology for WiFi Devices

FR‑4 dielectric is adopted as the standard substrate for conventional WiFi PCBs, offering balanced mechanical strength, insulation performance and cost efficiency.

For high-performance WiFi 6 / 6E and high-speed communication hardware, we deploy advanced HDI processes and high-energy laser drilling technology. It enables direct processing on 1180 glass cloth substrates, eliminating the limitation of special non-glass fiber copper foil and unifying material consistency for high-density circuit mass production.

All WiFi communication boards comply with IEEE 802.11 and IPC-6018A high-frequency specifications, effectively reducing signal loss and electromagnetic interference.

Industrial & Commercial Applications

WiFi modular circuits are extensively integrated into smart home appliances, intelligent monitoring systems, wireless control devices, medical data terminals, industrial measuring instruments and wireless IoT equipment, supporting global cloud interconnection and intelligent remote control.

Overall Factory Strength

As a comprehensive high-precision PCB manufacturer, Maxipcb provides turnkey manufacturing services including multi-layer high-density boards, HDI circuits, rigid-flex boards, high-speed / high-frequency PCBs and special ceramic substrates.

With a monthly output of 30,000 ㎡, complete automated production and testing equipment, independent surface treatment lines and professional engineering support, we support DFM optimization, rapid prototyping and volume production.

Certified with ISO 9001, UL, RoHS 2.0 and REACH, all products follow IPC international quality norms.

We provide 24/7 global technical support and efficient after-sales service, delivering stable, cost-effective PCB products for customers in Europe, North America, Southeast Asia and global markets.

Model : 8L 1+N+1 HDI

Material：FR-4

Layer ：8L1+N+1 HDI

Color ：Green /White

Finished Thickness：0.8m

Copper Thickness ：inner1OZ outer0.5OZ

Surface Treatment ：Immersion Gold + OSP

Min Trace / Space ：3mil/3mil

Min Hole ：Mechanical hole 0.2mm，Laser Hole 0.1mm

Application ：Micro electronic products pcb

1+N+1 Countersink hole HDI 8L PCB

Description

Data Sheet