1+N+1 Countersink hole 1 Layer 6 HDI for Mobile mainboard

Maxipcb is a professional manufacturer focusing on high-frequency and radio frequency circuit board production, with 17 years of in-depth accumulation in the domestic RF PCB industry.

Dielectric substrate selection is a core factor that determines the overall electrical performance, signal stability and operational reliability of high-frequency circuit boards. In the customized development and mass production of microwave-grade PCBs, key design indicators including operating frequency band, microwave power load, ambient temperature resistance range, as well as current and voltage specifications must be fully evaluated for material matching. Our technical team has long been engaged in the application research and process verification of various high-frequency substrates. A complete range of mainstream high-frequency and microwave materials are kept in sufficient stock to support rapid prototyping and mass production lead time.

High product reliability is supported by professional engineering capabilities and standardized production management. Our technical workshop and manufacturing team work closely with the internal quality assurance system to implement strict in-process inspection and finished product testing, ensuring every batch of products meets industrial manufacturing standards. We always adhere to quality-driven operation, focusing on long-term partnership rather than short-term market performance. Continuous repeated orders from global clients have become the most credible recognition of our product quality and service strength. Over the past 17 years, we have continuously upgraded production equipment, optimized manufacturing workflows and expanded high-precision processing technologies, growing steadily together with global cooperative customers.

We provide comprehensive processing services for international mainstream high-performance dielectric materials, covering multiple well-known brands: Rogers series high-frequency laminates including RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880 and RT5870. In addition, we support customized processing of Arlon, Isola, Taconic, PTFE F4BM and full-series Teflon low-loss materials.

To balance electrical performance and project cost, we provide diversified hybrid lamination designs combining high-frequency materials and conventional substrates. Available composite stacking options: Rogers RO4350B + FR4, RO4350B + high-Tg IT180, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4 and other customized mixed dielectric structures.

High-frequency microwave PCB products are widely deployed in multiple high-reliability fields, covering consumer electronics, aerospace and defense, high-power industrial equipment, medical instrumentation, automotive electronics and intelligent industrial control systems.

A full range of surface treatment solutions are available to adapt to different welding environments, conductive requirements and anti-aging standards: OSP, ENIG, Lead-free HASL, Hard Gold Plating, Soft Flash Gold, Immersion Tin, Immersion Silver and Electrolytic Gold.

We are capable of high-difficulty customized processing to meet diverse high-end design demands: Finger beveling, heavy copper circuitry, blind and buried via fabrication, precise impedance control, resin filled vias, carbon ink printing, backdrilling, countersink machining, controlled-depth drilling, half-plated holes, press-fit holes, peelable blue solder mask, removable solder resist coating, ultra-thick copper production and oversized board customization.

Flexible multi-layer design is available with layer counts ranging from 2 layers to 30 layers, supporting personalized stack-up schemes for high-frequency products. Multiple dielectric constant options are fully covered to satisfy high-speed signal transmission design: DK values: 2.20, 2.55, 3.00, 3.38, 3.48, 3.60, 6.15 and 10.2

Our high-frequency RF circuit boards are widely applied in antenna communication facilities, power amplifier modules, radar detection equipment, cellular handheld terminals, wireless WiFi modules, vehicle telematics, in-vehicle infotainment, computing hardware and sophisticated industrial high-frequency control units.