As the carrier of various components and the hub of circuit signal transmission, PCB is the most critical part of electronic products, and its quality directly determines the quality and reliability of the whole equipment.
As the carrier of various components and the hub of circuit signal transmission, PCB is the most critical part of electronic products, and its quality directly determines the quality and reliability of the whole equipment.
What Problems Need to Be Solved by PCB
- Reasonable component layout: High-power devices generate severe heat, and reasonable layout of these devices can balance the thermal load.
- Identification of overheated devices: Mismatch of device model selection and specification, long-term overheating operation, and the "short board effect" lead to premature failure of the entire circuit board.
- Cold solder joint and insufficient solder joint: Poor contact will cause unpredictable faults and increase after-sales costs.
- Heat dissipation optimization: Locate the thermal load area, evaluate the effect of the existing heat dissipation design, and formulate optimization and improvement measures.
- Short circuit: A critical taboo in design.
The chip is a critical and core component of the circuit, and its temperature will seriously affect its performance and service life.
What Problems Need to Be Solved by Chip
- Temperature of internal pins or connections of the unpackaged chip, which are generally fine, to prevent fusing caused by excessive temperature;
- Internal temperature distribution of the unpackaged chip, to check whether it is uniform to meet the requirements, or excessively high;
- Detection of the surface temperature distribution of the chip, or its operating temperature under different application conditions.
To address the above problems, "temperature" is a key indicator. Testing the change of "temperature" on the time axis through infrared thermal imaging technology is an important means to judge and solve the problems.
Advantages of Temperature Measurement with Infrared Thermal Imaging Technology
① Non-contact non-destructive testing with more accurate temperature measurement;
② Ultra-high infrared resolution, each thermal image can contain up to more than 1.3 million temperature data;
③ High-speed sampling, up to 30 frames per second;
④ Equipped with optional lenses of 20μm, 50μm and 100μm;
⑤ Support full-radiation thermal image video stream, record the whole process of temperature change, enable arbitrary secondary analysis of the video, and provide trend graphs, 3D graphs, numerical matrixes, etc.
I. PCB Circuit Board Design Optimization
Where is the highest temperature on the circuit board? It is difficult to identify with commonly used data acquisition equipment and infrared temperature measuring guns. The FOTRIC thermal imager can perform full-screen temperature measurement, collect and save the temperature data of the entire circuit board at one time, detect the temperature distribution of the PCB board efficiently and without blind spots, check whether the layout of heating devices and heat dissipation design are reasonable, and avoid the concentration of high-power devices that affects heat dissipation.
II. Chip Microscopic Distribution Detection
The LED power chip in the picture is as small as 1mm*1mm, and it is necessary to observe the temperature distribution on the chip surface after the LED is powered on. The yellow dots indicate the temperature of the metal chip after power-on, the 6 yellow dots should maintain consistent temperature, and the 2 white dots indicate the temperature of the non-metallic area, which should maintain consistent temperature.
Due to the small size of the chip, contact measurement is easy to change the temperature of the chip itself due to the contact object. The FOTRIC thermal imager adopts non-contact temperature measurement, supports a 20μm macro lens, and can directly perform micron-level microscopic temperature imaging detection on tiny chips, identify overheated connecting wires and connection points, and optimize the chip design.
III. SMD Fuse Temperature Detection
The SMD fuse is used to protect the circuit board. When the current is too large, the fuse will blow to protect the circuit. We need to timely observe the temperature change of the SMD fuse during the test to confirm the temperature at which it blows.
However, the fusing process of the SMD fuse is only about 300ms, which is difficult to capture by photography. The full-radiation thermal image video recording function of the FOTRIC thermal imager can record the temperature change and distribution during the power-on process in real time, and enable arbitrary post-analysis of the video, which facilitates problem identification and design improvement.
IV. Electronic Cigarette Temperature Test
Excessively high temperature in electronic cigarettes will affect the e-liquid composition and oil-conducting material, and the temperature of the smoke may also cause damage to the respiratory tract. Excessively high temperature is also easy to burn the atomizing core. To ensure product quality and improve production efficiency, more accurate and comprehensive temperature detection is required for the thermal conductivity of the substrate, heating wire arrangement and overall machine temperature measurement during product R&D, as well as the detection of the highest temperature point and heating uniformity during the production process.
About Maxipcb
Maxipcb empowers innovators to turn cutting-edge technologies into reality.
We offer one-stop solutions for design, simulation, testing, PCB manufacturing, component procurement and SMT assembly, enabling efficient development, rapid deployment and risk control across the full product lifecycle.Serving the world in communications, industrial automation, aerospace, automotive, semiconductor and beyond, we build a safer, more connected future together.
